ID:PT-511k Tear Film Tape ABBA™
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V6™Wafer De-Taping Tape Use:ABBA™ Wafer De-Taping Tape PT510 is a transparent polyester film with an adhesive specifically designed for the removal of the ABBA™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer..
V6™Wafer De-Taping Tape Feature:ABBA™An ideal 180-degree peeling technique is used when peeling back grinding tape from the wafer. The technique minimizes stress to the wafer while the tape is peeled, allowing the equipment to process thin wafers..
V6™Wafer De-Taping TapeExplanation:ABBA™ Peeling tape consumption does not vary with wafer size making for economical operation. Moreover, the peeling tape is of the thermo-compression type, ensuring secure lamination regardless of the presence of silicon dust on the back grinding tape. .
V6™Wafer De-Taping TapeSubstrate:material with a transparent polyester film material as the substrate, using Rubber adhesive. Wear - resistant, non - adhesive, tensile..
V6™Wafer De-Taping TapeSize:Can be customized according to customer requirements of different specifications (in line with EU environmental certification RoHS).
Width:50~630mm Length:100M Thickness:90μm |
Substrate
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PET
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Thickness
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50um±3
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Visco Sesystem
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AcrylicAcid 40um
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Total Thickness
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90um±3
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Adhesion Power |
26n/in±3%
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TensileStrength
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13kg/20mm
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Elongation
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100%
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Temperature
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-10~+100℃
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Width
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63cm
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Length
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100M
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Our creativity is all for your needs
TEL:+886 3 4861999 FAX:+886 3 4861990
E-mail:service@abba-applied.com sales@abbatape.com
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ABBA APPLIED TECHNOLOGY CORPORATION
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