ID:HR-120 Heat Release Tape ABBA™
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V6™Heat Release Tape Use:ABBA™Thermal release tape "REVALPHA" is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes.
V6™Heat Release Tape Feature:ABBA™The thermal release tape, is a unique adhesive tape. Adhesion equivalent to a normal adhesive tape at room temperatures, and can be easily peeled off when required, simply by heating..
V6™Heat Release Tape Explanation:ABBA™ Heat used for removal can be selected (90°C, 120°C, 150°C, 170°C) .As tape removal is guaranteed at a uniform temperature, higher levels. of labor-saving automation can be achieved. No damage to substrate. when removing tape.. when removing tape.
V6™Heat Release Tape Substrate:ABBA™ Wafer De-Taping Tape is polyester tape with strong rubber adhesive that is,manufactured in clean environment. is designed for removing of silicon wafer backgrinding tape The tape is for semiconductor component manufacturing processes.
V6™Heat Release Tape Size:Material with a transparent polyester film material as the substrate, using Rubber adhesive. Can be customized according to customer requirements of different specifications (in line with EU environmental certification RoHS).
Width:50~1000mm Length:100M Thickness:75μm |
Substrate
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PET
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Thickness
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50um±3
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Visco Sesystem
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AcrylicAcid 25um
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Total Thickness
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75um±3
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Adhesion Power |
26n/in±3%
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TensileStrength
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13kg/20mm
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Elongation
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100%
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Temperature
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-10~+100℃
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Width
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100cm
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Length
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100M
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Our creativity is all for your needs
TEL:+886 3 4861999 FAX:+886 3 4861990
E-mail:service@abba-applied.com sales@abbatape.com
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ABBA APPLID TECHNOLOGY CORPORATION
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