![]() Dicing Tape
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![]() HR-120-50-25
Need Application Tape? We have the right Heat Release Tape to fit your needs! HR-120-100-45 ABBA™The thermal release tape, is a unique adhesive tape. Adhesion equivalent to a normal adhesive tape at room temperatures, and can be easily peeled off when required, simply by heating HR125 ABBA™Thermal release tape "REVALPHA" is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes. HR124 Low ionic impurities and adhesion stability make this the perfect tape for your clean room
application. Excellent expandability. HR123 A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components. With greater diversity and higher quality in chips, HR-122 Thermal Release Tape For Hard Substrate HR-122
Capable of processing brittle wafer.
Capable of releasing/collecting semiconductor wafers at any stage by constant support of the semiconductor wafer using a supporting wafer. Especially recommended for semiconductor wafer backgrind processing.
Features:
Extremely thin grinding capability.
Eliminates warping and sagging by firmly supporting the wafer.
Easily releases at any time with heat treatment. HR121 Heat Release Tape
Tightly adheres and can easily be peeled off just by heating; perfect for temporary fixing. HR-120 ABBA™Thermal Release Sheet REVALPHA
Tightly adheres and can easily be peeled off just by heating; perfect for temporary fixing. UV201 UV Release Tape Low ionic impurities and adhesion stability make this the perfect tape for your clean room
application. Excellent expandability. UV202 UV Curable Dicing Tape OVERVIEW
Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. UV203 UV Release Tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes. UV204 UV Curable Dicing Tape with Liner
Adheres just like any normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating. UV205 BENEFITS
A very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. UV tape is an excellent fit for small-die application and non-standard substrate such as FR4 board BGA and Glass substrate. UV206 UV Curable Dicing Tape with Liner A very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.
UV tape is an excellent fit for small-die application and non-standard substrate such as FR4 board BGA wafers 1
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