Need Application Tape? We have the right Heat Release Tape to fit your needs!

ABBA™The thermal release tape, is a unique adhesive tape. Adhesion equivalent to a normal adhesive tape at room temperatures, and can be easily peeled off when required, simply by heating

ABBA™Thermal release tape "REVALPHA" is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes.

Low ionic impurities and adhesion stability make this the perfect tape for your clean room application. Excellent expandability.

A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components. With greater diversity and higher quality in chips,

Thermal Release Tape For Hard Substrate HR-122 Capable of processing brittle wafer. Capable of releasing/collecting semiconductor wafers at any stage by constant support of the semiconductor wafer using a supporting wafer. Especially recommended for semiconductor wafer backgrind processing. Features: Extremely thin grinding capability. Eliminates warping and sagging by firmly supporting the wafer. Easily releases at any time with heat treatment.

Heat Release Tape Tightly adheres and can easily be peeled off just by heating; perfect for temporary fixing.

ABBA™Thermal Release Sheet REVALPHA Tightly adheres and can easily be peeled off just by heating; perfect for temporary fixing.

UV Release Tape Low ionic impurities and adhesion stability make this the perfect tape for your clean room application. Excellent expandability.

UV Curable Dicing Tape OVERVIEW Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.

UV Release Tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes.

UV Curable Dicing Tape with Liner Adheres just like any normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating.

BENEFITS A very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. UV tape is an excellent fit for small-die application and non-standard substrate such as FR4 board BGA and Glass substrate.

UV Curable Dicing Tape with Liner A very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. UV tape is an excellent fit for small-die application and non-standard substrate such as FR4 board BGA wafers